Material Properties of a Low Contraction and Resistivity Silicon–Aluminum Composite for Cryogenic Detectors

We report on the cryogenic properties of a low-contraction silicon–aluminum composite, namely Japan Fine Ceramics SA001, to use as packaging structure for silicon devices. SA001 is composite material (75% by volume) and has low thermal expansion coefficient ( $$\sim $$ 1/3 that aluminum). The superconducting transition temperature measured be 1.18 K, which in agreement with pure aluminum thus available magnetic shield material. residual resistivity 0.065 µΩm, considerably lower than equivalent contraction immersed liquid nitrogen $$\frac{L_{293\,\mathrm {K}}-L_{77\,\mathrm {K}}}{L_{293\,\mathrm {K}}}=0.12\%$$ , consistent expected rate obtained from volume-weighted mean contractions aluminum. machinability also confirmed demonstrated fabrication conical feedhorn array, wall thickness 100 µm. These are suitable applications large-format detector